With the development of LED lighting products, LED tech […]
With the development of LED lighting products, LED technology is also constantly strong. The new technology is to improve the performance of LED products, but it also brings new problems:
The first problem is that in order to increase the luminous flux of a single tube, a larger current density is injected, so that the chip generates more heat and needs to dissipate heat.
Question 2, the new structure is packaged. As the power of LED light sources increases, multiple power LED chips need to be packaged together, which will generate more heat and require more effective heat dissipation structures and measures.
In addition to improving the efficiency of LED lights, the design of LED lights is light distribution requirements In order to improve the level of heat dissipation, materials with good thermal conductivity are used. In addition, it has better mechanical properties and tightness, and the radiator should be dust-proof. The temperature rise of the LED lamp should be 30°C. In order to improve the heat dissipation level, combined with the opinions of experts, Liangmeiju made several suggestions:
1. Starting from the LED chip, a new structure new process must be adopted to improve the heat resistance of the junction temperature of the LED chip and the heat resistance of other materials, thereby reducing the requirements for heat dissipation conditions.
2. Reduce the thermal resistance of the LED device, adopt a new structure to package the new structure select new materials with good heat resistance heat resistance, mixed rubber contains metal phosphor powder and other adhesive materials, so that the thermal resistance is ≤10°C/W or lower.
3. Reduce the temperature rise and use heat dissipation materials with good thermal conductivity as much as possible. There should be better ventilation holes in the design to dissipate the residual heat as soon as possible, and the temperature rise should be less than 30°C.
